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Home > Telecom boards >
CPCI Board
AP3600G4
Front Card
Motorola MPC750 G3 RISC Processor Companion Mode Operation with MPC8260 PowerQUICC II
Support MPC8260 Stand alone Mode
1Mbyte High-speed L2 Cache Memory for MPC750 G3
Support H110 CT Bus using Lucent Ambassador Chip-Set
64Bit PCI Bus and 32Bit PCI to PCI Bridge using PowerSpan Chip-Set
Up to 128Mbyte SODIMM type High-Speed SDRAM Module for PowerPC 60X Bus
16Mbyte(32Bit) Local Bus SDRAM
8Mbyte Flash Memory
32Kbyte EEPROM
One Fast Ethernet Interface
RS-232C Serial Interface
HW Watch-Dog Timer Support
CompactPCI 6U single slot for System Integration
Rear Card
Two Fast Ethernet Interface
Octal E1/T1 Interface
Processor
Microprocessor
MPC8260 133/133/66MHz
(Optional MPC8260 166/133/66MHz)
(Optional MPC8260 200/133/66MHz)
MPC750 200MHz
(Optional MPC750 300/400MHz)
On-Board L2 Cache
1Mbyte for MPC750 G3 Processor
Memory
Flash Memory
8Mbyte On-board Flash Memory
SDRAM
64Mbyte SDRAM(SODIMM Type)
(Optional 128 Mbyte SDRAM)
EEPROM
32Kbyte On-board EEPROM
I/O Capabilities
Front Card
One 10/100BaseTx Ethernet (RJ-45)
One RS-232C (DB-9)
Rear Card
8 E1/T1(RJ-48C)
Two 10/100BaseTx Ethernet (RJ-45)
CompactPCI Platform and Interface
Form Factor
6U Eurocard CompactPCI form factor
Host Interface
Compliant with PCI Specification R2.1, 2.2
CompactPCI
PICMG CompactPCI Specification R2.1, 2.2
PMC Slot
One PMC slot
Hot Swap
PICMG Hot Swap Specification R1.0
J1, J2 PCI Bus
32/64bit, 33/66MHz PCI bus using PowerSpan Chip-set
J4 CT Bus
ECTF H.110 Compliant CT Bus using Lucent T8105 Ambassador Chip-set via J4
J5 User define Bus
Provided through Rear Transition Module for 8 E1/T1 and Two 10/100BaseTx Interface
Environments
Temperature
0¡ÆC to + 55¡ÆC
Relative Humidity
5% to 95%
Power
+5Volt 20Watt
Dimension
Height, Depth
233.4mm(9.2in.)X160.0mm(6.3in.)
Width, Front Panel Height
19.8mm(0.8in.)X261.8mm(10.3in.)
Max. Component Height
15.0 mm(0.60in.)
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AddPac Technology